Neoflex Technology Co., Ltd., an ISO9001 company, offer a full range of integrated service built around partnering and customer satisfaction. Our extensive knowledge of manufacturing FPC enables us being innovative toward manufacturing process, layout designing , as well as quick turn prototype. Neoflex offers its customers a complete flexible printed circuit interconnection solution, from initial design through circuit fabrication, high-level assembly, functional testing, and even base material (CCL) selling. Also, our roll-to-roll circuitry fabrication approach guarantees our customers with in time delivery and competitve price.

Being an ISO registered and UL approved facility, we are here to serve our customers in every way we could with our quality product and service.

R & D Ability

For the development of FPC technology, our technical team dedicates to the development of finer trace / width technology ( from 2mil/2mil to 1mil/1mil), FPC for direct IC bonding, multi-layer FPC and flexible-rigid FPC.

We prossesses not only FPC manufacturing technology but also raw material R&D and production ability. Our material can meet 3000 times bending requirement, eliminate EMI effect in Note Book Computer application, and PSC (photo sensitive coverlay technology) for under 50um board thickness application. In the meantime, raw material production ability enables us to supply competitive price for our customers.